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Taiwan Academic Institutional Repository >
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"young h t"
Showing items 76-85 of 196 (20 Page(s) Totally)
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| 臺大學術典藏 |
2018-09-10T09:45:20Z |
Using Grey relational analysis to determine wet chemical etching parameters in through-silicon-via etching application
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HONG-TSU YOUNG; HONG-TSU YOUNG;Young, H.-T.;Tang, C.-W.;HONG-TSU YOUNG; Tang, C.-W.; Young, H.-T. |
| 臺大學術典藏 |
2018-09-10T09:45:20Z |
Improving the dielectric breakdown field of silicon light-emitting-diode sub-mount by a hybrid nanosecond laser drilling strategy
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Tang, C.-W.; Li, K.-M.; Yang, M.; Liao, H.-C.; Young, H.-T.; HONG-TSU YOUNG; KUAN-MING LI |
| 臺大學術典藏 |
2018-09-10T09:44:04Z |
A method of comparing the speed of starlight and the speed of light from a terrestrial source
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Chang, S.-T.; Tsao, H.-W.; Huang, Y.-R.; Lee, S.-L.; Chang, C.-C.; Lin, W.-C.; Tsay, H.-L.; Wang, Y.-L.; Huang, P.-H.; Hsu, M.-Y.; Hsu, C.-W.; Lin, S.-C.; Hung, Y.-J.; Shiu, Y.-L.; Hsiao, Y.-C.; Chang, J.-Y.; Tsai, D.P.; Huang, T.-M.; Young, H.-T.; Liu, Y.-C.; Chang, C.-M.; Chiang, W.-C.; Huang, J.-Y.; Chen, Y.-H.; Wu, J.; HEN-WAI TSAO et al. |
| 臺大學術典藏 |
2018-09-10T09:19:04Z |
Innovative through-silicon-via formation approach for wafer-level packaging applications
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Li, Kuan Ming; KUAN-MING LI; Young, Hong Tsu; Tang, Chao Wei; HONG-TSU YOUNG; Li, Kuan Ming; Young, Hong Tsu; Tang, Chao Wei; Tang, C.W.; Young, H.T.; Li, K.M. |
| 臺大學術典藏 |
2018-09-10T09:19:04Z |
Enhancement of through silicon via (TSV) sidewall quality by nanosecond laser pulses with chemical etching process
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Tang, C.-W.; Young, H.-T.; Li, K.-M.; HONG-TSU YOUNG; KUAN-MING LI |
| 臺大學術典藏 |
2018-09-10T09:19:03Z |
Study the keyhole welding performance with enthalpy method in upwind scheme
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HONG-TSU YOUNG;Young, H.T.;Ho, J.-E.;HONG-TSU YOUNG; Ho, J.-E.; Young, H.T.; HONG-TSU YOUNG |
| 臺大學術典藏 |
2018-09-10T09:19:03Z |
Robust process design towards through-silicon via quality improvement based on Grey-Taguchi method
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Tang, C.-W.; Chuang, L.-C.; Young, H.-T.; Yang, M.; Liao, H.-C.; HONG-TSU YOUNG |
| 臺大學術典藏 |
2018-09-10T08:37:59Z |
Reduction of 2D/3D image cross-talks with micro-optical elements by Nano-imprint
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Yeh, C.-H.; Chang, F.-Y.; Wang, H.-C.; Chung, E.; Young, H.-T.; HONG-TSU YOUNG |
| 臺大學術典藏 |
2018-09-10T08:37:59Z |
Online condition-based shaft faults diagnosis with multiscale entropy
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Wang, C.; Lin, W.-Y.; Wang, Y.-H.; Young, H-.T.; Lee, K-T.; Pan, Y-H; Wang, C.; Lin, W-Y; Wang, Y-H; Young, H-T; Lee, K-T; Pan, Y.-H.; HONG-TSU YOUNGet al.; Pan, Y-H; Wang, C.; Lin, W-Y; Wang, Y-H; Young, H-T; Lee, K-T |
| 臺大學術典藏 |
2018-09-10T08:37:59Z |
Enhancing fracture strength of thinned silicon dies by a hybrid micromachining method
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Lin, C.-C.; Young, H.-T.; Tang, C.-W.; Tsai, M.-Y.; HONG-TSU YOUNG |
Showing items 76-85 of 196 (20 Page(s) Totally)
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